The article from: Peoples Posts and Telecommunications News  2022-06-14 00:00

Shenzhen Development and Reform Commission, Science and Technology Innovation Commission of Shenzhen city, Industry and Information Technology Bureau of Shenzhen City, State-owned Assets Supervision and Administration Commission of Shenzhen City recently released "Shenzhen City to cultivate and develop semiconductor and integrated circuit industrial cluster action Plan (2022-2025)". The plan proposes that by 2025, the industrial revenue will exceed 250 billion yuan, more than 3 design enterprises with revenue of more than 10 billion yuan and a batch of design enterprises with revenue of more than 1 billion yuan will be formed, and 3 manufacturing enterprises with revenue of more than 2 billion yuan will be introduced and cultivated. The level of integrated circuit industry will be significantly improved and the industrial structure will be more reasonable. Plan, by 2025, built with the influence of the semiconductor and integrated circuit industry cluster, industry scale, manufacturing, testing and so on key link leading domestic level, industrial linkage synergy to further strengthen and further enhance our capacity for independent innovation, in key products and technologies on prominent comparative advantage, through a number of key core technology, A number of key enterprises and innovation platforms have been formed, and several professional INTEGRATED circuit industrial parks have been built to support and lead the high-quality development of strategic emerging industries in Shenzhen. In terms of technological innovation, we plan to make sure that the overall design level will enter the leading camp, and the manufacturing capacity will be in the leading competitiveness. The wide band gap semiconductor technology capability will form a strong support for key application fields. By 2025, the r&d investment intensity of backbone enterprises in the design industry will exceed 10%, the intensity and quality of invention patents will be significantly improved, the market share of domestic EDA software will be further increased, a batch of key technology transformation and batch application will be realized, a perfect talent introduction and training system will be formed, and more than 5 public technical service platforms will be built. In the field of high-end chips that attract much attention, the plan calls for breakthroughs in the design of high-end general chips such as CPU, GPU, DSP and FPGA, and the development of special chips such as artificial intelligence chips and edge computing chips. Led by the 5G communication industry, the company has made breakthroughs in rf front-end chips, baseband chips, optoelectronic chips and other core chips. Focus on intelligent "terminals" and other pan-Iot applications, and promote the rapid industrialization of ultra-low power consumption dedicated chips and NB-iot chips. Focusing on emerging industries such as intelligent vehicles, we will actively cultivate upstream chip supply chains such as lidar.