Stmicroelectronics provides silicon carbide technology

Technology Oasis • Source: STMICROELECTRONICS PDSA • Author: stmicroelectronics PDSA • 2022-05-26 09:45 

Serving multiple electronic applications, the worlds leading semiconductor company STMicroelectronics (ST; Nyse: STM) announced the supply of silicon carbide (SiC) technology for the eMPack® electric vehicle power modules from Semikron, the worlds leading power module system vendor.

The supply agreement is the result of a four-year technical cooperation between the two companies. With stMAs advanced SiC power semiconductors, both companies are committed to achieving superior energy efficiency in more compact systems and reaching industry benchmarks in terms of performance. SiC is rapidly becoming the automotive industrys preferred power technology for traction drive of electric vehicles, helping to improve range and reliability. Semic recently announced that it has secured a 1 billion euro purchase contract to supply the innovative eMPack power module to a leading German automotive manufacturer starting in 2025.

Karl-heinz Gaubatz, CEO and CTO of Semichem, said:"

STs industry-leading SiC device manufacturing capabilities and deep technology accumulation allow us to combine these cutting-edge semiconductor chips with our advanced manufacturing processes to improve reliability, power density and scalability to meet the needs of the automotive industry. As our new products move into mass production, working with ST ensures a robust and reliable supply chain that allows us to better control product quality and delivery schedules.

"Said Edoardo Merli, Executive Vice President and General Manager of Power Transistor Products at STMICROELECTRONICS.

Using our SiC technology, Semics advanced expandable eMPack series power modules will make a significant contribution to the development of zero-emission vehicles. In addition to driving a revolution in electric vehicles, our third-generation SiC technology is advancing energy efficiency, performance and reliability for sustainable energy and industrial power control applications.

Stmas advanced third generation SiC technology offers industry-leading process stability and performance. STPOWER SiC MOSFET technology, which controls power switch operation in ev main traction inverters, is integrated with Semiconductors innovative full sintered Direct crimp chip (DPD) packaging technology. DPD technology enhances the performance and reliability of power modules and improves power and voltage at a low cost. Using STSTs SiC MOSFET bare-sheet parameters, Semic has built the 750V and 1200V eMPack product platforms for 100kW to 750kW applications and 400V to 800V battery systems.

STPOWERs extensive PORTFOLIO of SiC MOSFET products is now in production in standard power or bare chip packages. Bare chip is ideal for advanced power modules that value high power density processing. For samples and inquiries, please contact our local STMICROELECTRONICS sales representative.